Showing results: 1 - 15 of 137 items found.
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GEN3000T -
Toray Engineering Co., Ltd.
GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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7940 -
Chroma ATE Inc.
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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LS4k -
Teledyne e2v
The LS4k is a high speed CMOS System on Chip (SoC) line scan image sensor optimized for applications requiring short exposure times and high accuracy line rates. It incorporates on chip two pixel arrays consisting of 2 rows with 4,096 7µm pitch pixels and 4 rows with 2,048 14µm pitch pixels respectively, a high accuracy (12-bit) high speed (84MHz) analog-to-digital conversion (ADC), and sophisticated on chip optical calibration for PRNU, DSNU, and lens shading correction.
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M9033A -
Keysight Technologies
The M9033A PXIe System Synchronization Module is a dual-slot, 5-port module that provides multi-module and multi-chassis synchronization and triggering for Keysight's modular instruments.
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M9032A -
Keysight Technologies
The M9032A has a Soft Front Panel (SFP) that provides a graphical user interface to the system sync module. It allows the user to set up the most commonly used functionalities of the module. The SFP also gives you the ability to check the module's connection status, configure the reference clock and IO settings, and perform firmware udpates.
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Chroma ATE Inc.
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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TL2000 -
ficonTEC Service GmbH
ficonTEC’s series of testing machines is focused on automated electro-optical characterization ofsemiconductor chips. The ficonTEC TL2000 is a fully automated test and inspection system for unmountedlaser diode bars, single chips and chips on submounts.
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STMicroelectronics
ST provides a large selection of Power Management ICs and System Basis Chips (SBC) specifically designed for automotive electronic systems.
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Sentinel -
Jaeshininfo Co. Ltd
The first single system on chip module. Measures cell voltage, cell internal temperature and cell impedance.
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R-Car -
Renesas Electronics Corp.
"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
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Wind River
With Wind River® Simics® you can simulate anything, chip to system, giving you a path to DevOps and Continuous Integration and Deployment.
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KLA-Tencor Corp
KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.
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Wewon Environmental Chambers Co, Ltd.
Probe card manufacturing need the semiconductor test equipment. When we designed the thermal testing equipment, Only some commonly used test items are packaged into the IC tester, and the logic function of the verification chip is implemented in a fixed test mode. But as chip products diversify, Some thermal inducing system can no longer do it alonehttps://www.wewontech.com/semiconductor-test-equipment/
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ComEth4070e -
ELMA Electronic, Inc.
The ComEth 4070e is a cutting-edge 6U Layer 2/3 Ethernet switch for VME64x systems. Powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
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CSE Co.,Ltd
Vertical Probe Card. (Mobile D-RAM, L.D.I Flip Chip 60um Pitch,. System LSI, Soc Devices). Cantilever Probe Card. Low Leakage Probe Card.